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Position: BGA Packaging Engineer
Designing single die, multi die BGA, Chip Scale laminate BGA,
review and optimize new substrate according to design spec
for new packages (feasibility, trace routing, design spec.,
etc)
Perform electrical and package simulation in relation to
substrate design and data analysis (inductance, resistance,
voltage, power etc) and be able to identify the root cause
for substrate related issue.
Deal with substrate supplier in qualifying new substrate
technology or roadmap
Work closely with the process team to further improve
process stability
Responsible for New Package Qualification project leader to
coordinate the progress of all engineering and qualification
lots. It also include coordinating the progress of FAI,
reliability test and BOM generation and documentation
Responsible for Material engineering integration to support
material related issues and challenges, value engineering
activities (i.e. cost saving) and design for
manufacturability in new packages
Requirements
Please eMail your resume to
hr@natronix.net
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