Defining The Future Through Partnerships

Natronix Semiconductor Technology 

an OSAT & Design Company-

 

 

 

Package Reliability
 

Reliability tests are prerequisite before releasing any Integrated Circuit product to the market by the Chip Manufacturers. Various environmental stress tests simulate different failure modes. The significance of these tests is to accelerate the failure mechanism, which could happen during the intended life cycle of the product.
 

SPEL established a comprehensive reliability monitoring program in accordance with the JEDEC and MIL-STD-883 standards. These tests are conducted during New Package Qualification. SPEL also does these tests semi-annually on all the packages on sample basis to ensure the outgoing product quality.
 
Environmental Reliability Stress Test
 
1.     Highly Accelerated Temperature and Humidity Stress Test
2.     Unbiased Pressure Pot Test
3.     High Temperature Storage Life Test
4.     Steady State Temperature Humidity Bias Life Test
5.     High Temperature Operating Life Test
6.     Temperature Cycling Test
7.     Low Temperature Storage Life Test
8.     Preconditioning Tests
9.     MSL Tests
Mechanical Test
1.    Solderability Test
2.     Lead Integrity Test
3.     Test Wire Bond Pull Strength Test
4.     Solder Reflow Test
5.     Drop Test
6.     Wire Bond Shear Test
7.     Whisker Test Analysis
8.     Resistance To Solder Heat Temperature
 
 
 
 
 

 

 

 

SPEL Semiconductor Limited is India’s first & only Semiconductor IC Assembly & Test facility. SPEL pioneered the Outsourced Semiconductor Assembly & Test Services (OSAT) market in India and continues to steadily do so. SPEL is a trusted & strategic contract manufacturing partner for many of the world's leading Semiconductor companies.

SPEL Center Page
 

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