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Post:
Wire bond Process Engineer
Company:
SPEL Semiconductor Limited
Location:
Maraimalai Nagar, Chennai, India
Qualifications:
Degree in Mechanical / Electronic Engineering or equivalent.
Skills:
a) Process experience in Assembly operation such as machine set up and die set conversion in transfer mold ASA Mold and Kigaint
b) Mold Parameter optimizing
c) DOE performing and mold parameter optimization
d) Process-related problem solving
e) Yield improvement activities.
f) Low yield analysing
g) Mold die set conversion
h) Equipment troubleshooting
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