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Natronix Semiconductor Technology 

an OSAT & Design Company-

 

 

 

Failure Analysis
 

When a electrical failure is encountered in a product either in the field or during product development stage, it needs to be analyzed to find the root cause. The failures could be internal or external and the reasons could be manifold. Proper Failure Analysis helps us to pinpoint the exact root cause so that a remedial action could be taken.

 

SPEL’s FA lab supports the following FA services with state-of–the-art equipment. SPEL offers these services to its Customers at very competitive prices.

 
Non-Destructive analysis
 
1. Optical Inspection at 1000X
2. X-ray Inspection for internal assembly abnormalities – PHOENIX, USA
3. Scanning Acoustic Microscopic Inspection - SAM (Through Scan, C-scan, B-scan & A-scan) – SONIX , USA
4. XRF - Oxford, USA
 
Destructive analysis
 
1. Chemical Decapping - Nisene, USA
2. Cross Sectional analysis - Buehler, USA
3. Ball Shear - Royce, USA
4. Wire Pull Test - Royce, USA
 
 

 

 

 

SPEL Semiconductor Limited is India’s first & only Semiconductor IC Assembly & Test facility. SPEL pioneered the Outsourced Semiconductor Assembly & Test Services (OSAT) market in India and continues to steadily do so. SPEL is a trusted & strategic contract manufacturing partner for many of the world's leading Semiconductor companies.

SPEL Center Page

 

 

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