Natronix : SPEL : FA Services

Failure Analysis

When a electrical failure is encountered in a product either in the field or during product development stage, it needs to be analyzed to find the root cause. The failures could be internal or external and the reasons could be manifold. Proper Failure Analysis helps us to pinpoint the exact root cause so that a remedial action could be taken.

SPEL’s FA lab supports the following FA services with state-of–the-art equipment. SPEL offers these services to its Customers at very competitive prices.

Non-Destructive analysis


1.	Optical Inspection at 1000X

2.	X-ray Inspection for internal assembly abnormalities – PHOENIX, USA

3.	Scanning Acoustic Microscopic Inspection - SAM (Through Scan, C-scan, B-scan & A-scan) – SONIX , USA

4.	XRF - Oxford, USA

Destructive analysis


1.	Chemical Decapping - Nisene, USA

2.	Cross Sectional analysis - Buehler, USA

3.	Ball Shear - Royce, USA

4.	Wire Pull Test - Royce, USA