Natronix : SPEL : Packaging

SPEL’s Packaging Portfolio broadly classified into Leaded (Through hole & SMD) packages and QFN packages. Offers one of Industry’s widest range of packages in QFN with the footprint options from 0.5mm² to 12.0mm² and thickness options from 0.4mm to 0.9mm.

SPEL’s QFN / DFN package have the following advantages


	QFN wettable flank Packaging options

	Wide range of Packages already tooled up for immediate Customer Qualification

	New Package can be developed in 4weeks time & at very low Cost using its in-house Design expertise

	Jedec and non Jedec Custom Package options

	Use of Assembly & Process Technologies like Chip on Board (COB) and Wafer Backside Coating for reduced package foot-print

	Multi Die, Multi Wire, Stacked Die capability

	Wire-Bonding options – Au Wire, Cu Wire, PdCu Wire

	Lead-Finish option – 100% Sn, NiPdAu

	Shipment options – Tray, Shipping Tube, Cannister

	Complementing Test Toolings for Cost effective Turnkey Solution

SPEL’s Package Road Map is aligned with evolving Industry and Customer requirements reinforcing the commitment of providing Cost effective & high Quality packaging solutions.