Consumer needs using electronic technology is rapidly changing with the drive towards getting smarter, faster, smaller & cheaper systems with improved functionality. Semiconductors play a prominent role in achieving this with their higher integration potential. SPEL’s package roadmap encompasses the increasingly complex packaging requirements to support virtually most of the packaging needs of the semiconductor industry.

SPEL’s technology road map includes investment on growth packages like BGA, WLCSP, Flip chip packaging, System in Package, MEMS and new emerging packaging technologies like 3D packaging & WLCSP. These packaging technologies are adopted in wide range of devices such as smartphones, gaming, Automotive, Entertainment & handheld intelligent systems.

SPEL offers cost effective turnkey packaging services to Customers. As a major subcon, SPEL is geared towards meeting the industry’s ever growing needs for faster, lighter, smaller & high performance chips. SPEL is able to meet this by offering a wide portfolio of Packaging & Test technology with state-of-art equipment & versatile operational scale.

SPEL’s services are utilized by major Integrated Device Manufacturers (IDMs) also to a larger extent. By working with SPEL, Customers are able to reduce their manufacturing costs and focus on their core competencies. SPEL also offers a choice to use its exhaustive list of more than 100 QFN open tools to shorten the product launch time-frame.

SPEL is an ideal choice for business partnership for all design houses to get their products assembled with right Packaging technology & enabling them for shorter time to market.

Customers have trusted SPEL as their manufacturing partner for Assembly & Test services for more than 2 decades. They prefer SPEL as their partner for the Quality, Cost competitiveness, Cycle time performance and excellent Service (QCDS factors). Our Customers have been making sizeable investments by establishing captive lines at SPEL thereby enjoying benefits in terms of pricing, cycle time & capacity. Customers are very much impressed with this “Partnership model” with us and continue to make use of it for their growth as well as minimizing their operational expenses. With a strategic package road map in line with current market demands, SPEL is well prepared to be the most preferred assembly & test partner.

SPEL offers a range of turnkey services like

• Self-Clearance from airport customs

• Die bank storage at Nitrogen atmosphere

• Wafer Sort

• Assembly Services

• Final Electrical Test Services

• Tube / Tape & Reel / Tray packing

• Custom packing / labeling

• Finished goods store

• Drop-shipment to end-Customers    

• Quickest cycle time 

• Build sheet generation support using A-CAD

• Preproduction Engineering lots Support & Fast track turnaround

• Chip on Board (COB) assembly

• New Package development in short time (12 Weeks Max)

• Leadframe & Package design support (4 Weeks Max)

• Attractive pricing for Customers consigning equipment and Customers investing for captive line support

• Assembly prototyping support & failure analysis services for local design houses

• Low speed saw / Grinder / Polisher

• Microfocus X-ray Inspection

• Microzoom / Stereo Microscopes (High Power)

• Scanning Acoustic Microscope

• Package decapsulation -Chemical (Jetetch)

• IR reflow oven

• Microzoom / Stereo Microscopes (High Power)

• Scanning Electronic Microscope (third party labs)

With the guidance of an eminent board & dynamic leadership, SPEL is on target with respect to growth on Revenue, Volume, Technology & Customers. There is ample land in the factory to support our planned expansion. SPEL has also mastered its hiring & training methodology thereby enabling faster scaling-up of technology & capacity.

Our Employees know that Leadership is related to Action and not Position. The Management Team has been creating an Open Work Environment, encouraging people to exhibit their leadership skills through various initiatives. SPEL has been growing by nurturing its people to become Leaders who will continue to make their impact in the Semiconductor Industry.